DocumentCode :
11542
Title :
Performance Analysis of System-on-Chip Applications of Three-dimensional Integrated Circuits
Author :
Paul Franzon استاد مشاور , Douglas Barlage استاد مشاور , W. Rhett Davis استاد راهنما
University :
Virginia Polytechnic Institute and state University
Grade :
نامعلوم
Major :
Master of Science )Program Computer Engineering(
Number of pages :
0
Publish Date :
2005
Keyword :
MOSFET temperature effects , 3D interconnect , 3D circuits , 3D physical design , OpenRISC 1200 Architecture , Three-dimensional integration , 3D IC , 3D SoC Design , Temperature Dependent Circuit Modeling , 3D Power Dissipation and Critical Path Delay Analy , FDSOI 3D Process , 3D IC Design Flow
Note :
01
Language :
انگليسي
Link To Document :
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