DocumentCode :
1277
Title :
Chemical Vapor Deposition of Thin Films for ULSI Interconnect Metallization
Author :
Andrew W. Maverick استاد مشاور , Kerry M. Dooley استاد مشاور , Douglas P. Harrison استاد مشاور , Gregory L.Griffin استاد راهنما
University :
Lovisiana State University
Grade :
دكتري
Major :
Doctor of Philosophy )Ph.D.( )Chemical Engineering(
Number of pages :
0
Publish Date :
2005
Keyword :
interconnect metallization , Cu)hfac(2 , Copper , Reaction Mechanism , chemical vapor deposition , TaF5 , barrier layer , electroless deposition , SiH4 , seed layer , Pd)hfac(2 , tantalum , PALLADIUM
Note :
01
Language :
انگليسي
Link To Document :
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