DocumentCode :
15436
Title :
SOME CHEMICAL AND ELECTROCHEMICAL ASPECTS OF THE CHEMICAL MECHANICAL POLISHING OF COPPER
Author :
Barbara A. Shaw استاد مشاور , Howard W. Pickering استاد مشاور , Tarasankar DebRoy استاد مشاور , Kwadwo Osseo-Asare استاد راهنما
University :
The Pennsylvania State University
Grade :
نامعلوم
Major :
PhD )Materials Science and Engineering(
Number of pages :
0
Publish Date :
2002
Keyword :
CMP , chemical mechanical polishing , benzotriazoe , BTA , hydroxylamine , Copper , bare metal , Hydrogen peroxide
Note :
01
Language :
انگليسي
Link To Document :
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