Title :
Wafer Level Chip Scale Packaging Using Wafer Bonder
Author :
Pratul K. Ajmera استاد راهنما , Jin-Woo Choi استاد مشاور , Bingqing Wei استاد مشاور
University :
Lovisiana State University
Major :
Master of Science in Electrical Engineering )M.S.E.E.( )Electrical Computer Engineering(
Keyword :
glass etching , anodic bonding , silicon etching , WLCSP , wafer bonder
