DocumentCode :
20573
Title :
A Selective Encapsulation Solution For Packaging An Optical Micro Electro Mechanical System
Author :
Richard D. Sisson Jr. استاد راهنما , Isa Bar-On استاد مشاور
University :
WPI
Grade :
نامعلوم
Major :
MS )Materials Science Engineering(
Number of pages :
0
Publish Date :
2002
Keyword :
die bow , encapsulant , encapsulate , electrochemical migration , wirebonds , micro electro mechanical systems , Packaging , die warpage , ELECTRONICS , MEMS , Corrosion
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=20573
