• DocumentCode
    24461
  • Title

    MPSA Effects on Copper Electrodeposition: Understanding Molecular Behavior at the Electrochemical Interface

  • University
    Brigham young University
  • Grade
    نامعلوم
  • Major
    Chemical Engineering
  • Number of pages
    0
  • Publish Date
    2005
  • Keyword

    sodium , cupric , cuprous , Copper , Acceleration , Ab initio , Deposition , Inhibition , Quantum mechanics , Cluster , molecular simulation , Molecular dynamics , rotating disk electrode , MPSA , SPS , chloride , surface , Metal

  • Note
    01
  • Language
    انگليسي