DocumentCode
24461
Title
MPSA Effects on Copper Electrodeposition: Understanding Molecular Behavior at the Electrochemical Interface
University
Brigham young University
Grade
نامعلوم
Major
Chemical Engineering
Number of pages
0
Publish Date
2005
Keyword
sodium , cupric , cuprous , Copper , Acceleration , Ab initio , Deposition , Inhibition , Quantum mechanics , Cluster , molecular simulation , Molecular dynamics , rotating disk electrode , MPSA , SPS , chloride , surface , Metal
Note
01
Language
انگليسي
Link To Document