DocumentCode :
24461
Title :
MPSA Effects on Copper Electrodeposition: Understanding Molecular Behavior at the Electrochemical Interface
University :
Brigham young University
Grade :
نامعلوم
Major :
Chemical Engineering
Number of pages :
0
Publish Date :
2005
Keyword :
sodium , cupric , cuprous , Copper , Acceleration , Ab initio , Deposition , Inhibition , Quantum mechanics , Cluster , molecular simulation , Molecular dynamics , rotating disk electrode , MPSA , SPS , chloride , surface , Metal
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=24461