Title :
Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution
Author :
Fedorov Andrei G. استاد مشاور , Joshi Yogendra استاد راهنما , Graham Samuel استاد مشاور
University :
Georgia University Of Technology
Major :
Master of Science )Mechanical Engineering(
Keyword :
Thermal management , liquid cooling , single phase convection
