DocumentCode
3053
Title
Characterization of Nanostructured Metals and Metal Nanowires for Ultra-High Density Chip-to-Package Interconnections
Author
C. P. Wong استاد مشاور , Rao R. Tummala استاد راهنما , Ashok Saxena استاد مشاور
University
Georgia University Of Technology
Grade
دكتري
Major
Doctor of Philosophy )Materials Science Engineering(
Number of pages
0
Publish Date
2006
Keyword
Copper , nickel , grain growth , Nanocrystalline , fracture , Fatigue , Creep
Note
01
Language
انگليسي
Link To Document