Title :
Characterization of Nanostructured Metals and Metal Nanowires for Ultra-High Density Chip-to-Package Interconnections
Author :
C. P. Wong استاد مشاور , Rao R. Tummala استاد راهنما , Ashok Saxena استاد مشاور
University :
Georgia University Of Technology
Major :
Doctor of Philosophy )Materials Science Engineering(
Keyword :
Copper , nickel , grain growth , Nanocrystalline , fracture , Fatigue , Creep
