Title :
Chip-Package Nano-Structured Copper and Nickel Interconnections with Metallic and Polymeric Bonding Interfaces
Author :
TUMMALA V. M. RAO استاد راهنما , Liu Meilin استاد مشاور , Swaminathan Madhavan استاد مشاور
University :
Georgia University Of Technology
Major :
Doctor of Philosophy )Materials Science Engineering(
Keyword :
Fine Pitch , CHIP , Nano-Copper , Nano-Nickel , Package , Interconnections , NANO
