DocumentCode
3259
Title
Chip-Package Nano-Structured Copper and Nickel Interconnections with Metallic and Polymeric Bonding Interfaces
Author
TUMMALA V. M. RAO استاد راهنما , Liu Meilin استاد مشاور , Swaminathan Madhavan استاد مشاور
University
Georgia University Of Technology
Grade
دكتري
Major
Doctor of Philosophy )Materials Science Engineering(
Number of pages
0
Publish Date
2006
Keyword
Fine Pitch , CHIP , Nano-Copper , Nano-Nickel , Package , Interconnections , NANO
Note
01
Language
انگليسي
Link To Document