Title :
AIR-GAPS VIA THERMALLY DECOMPOSABLE POLYMERS AND THEIR APPLICATION TO COMPLIANT WAFER LEVEL PACKAGING )CWLP(
Author :
Kohl Paul A. استاد مشاور , Martin Kevin P. استاد مشاور , Bidstrup Allen Sue Ann استاد راهنما
University :
Georgia Institute Of Technology
Major :
Doctor of Philosophy
Keyword :
compliant interconnection , Sea of Leads )SoL( , Muhannad S. Bakir , polynorbornene
