DocumentCode :
4459
Title :
Development of Convective Solder Reflow and Projection Moire System and FEA Model for PWBA Warpage Prediction
Author :
C. P. Wong استاد مشاور , I. Charles Ume استاد راهنما , Jiahui Pan استاد مشاور
University :
Georgia Institute Of Technology
Grade :
دكتري
Major :
Doctor of Philosophy
Number of pages :
0
Publish Date :
2006
Keyword :
Computational fluid dynamics , PWBA , projection moire , warpage , Finite element , Measurement , Prediction , segmentation , snakes , convective solder reflow , active contours , FEA
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=4459