DocumentCode :
4524
Title :
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
Author :
C.P. Wong استاد راهنما
University :
Georgia Institute Of Technology
Grade :
دكتري
Major :
Doctor of Philosophy
Number of pages :
0
Publish Date :
2003
Keyword :
Electronic packaging Materials , epoxy resins , electric conductivity , Constraints )Physics( , Drugs Design.
Note :
01
Language :
انگليسي
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=17&DC=4524