4585

Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials

Sitaraman Suresh استاد راهنما

Georgia Institute Of Technology

دكتري

Doctor of Philosophy

0

2005

Delamination , Reliability , interface fracture toughness , fatigue crack propagation , no-flow underfill , Flip chip , nano-filled underfill , thermo-mechanical

01

انگليسي