DocumentCode
4585
Title
Study of Interfacial Crack Propagation in Flip Chip Assemblies with Nano-filled Underfill Materials
Author
Sitaraman Suresh استاد راهنما
University
Georgia Institute Of Technology
Grade
دكتري
Major
Doctor of Philosophy
Number of pages
0
Publish Date
2005
Keyword
Delamination , Reliability , interface fracture toughness , fatigue crack propagation , no-flow underfill , Flip chip , nano-filled underfill , thermo-mechanical
Note
01
Language
انگليسي
Link To Document