4731

In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests

Daniel F. Baldwin استاد راهنما

Georgia University Of Technology

دكتري

Doctor of Philosophy )Mechanical Engineering(

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2003

Flip chip technology Testing , Microelectronic packaging Materials Testing , Semantic networks )Information theory( , Network performance )Telecommunication( , Semiconductors Defects , Antimony Environmental aspects

01

انگليسي