Title :
Measurement, optimization and multiscale modeling of silicon wafer bonding interface fracture resistance
Author :
Delannay Francis استاد راهنما , Dewolf Ingrid استاد مشاور
University :
UCL )Les Bibliotheques de L,Universite Catholique de Louvain(
Major :
FSA 3 - Doctorat en sciences appliqu{ف }es
Keyword :
Wafer bonding , Interface toughness , multiscale modeling
