Title :
Flip Chip testing with a capacitive coupled probe chip.
Author :
Rhett Davis استاد مشاور , Paul Franzon استاد راهنما , Dennis Bahler استاد مشاور
University :
Virginia Polytechnic Institute nad State University
Major :
PhD )Electrical Engineering(
Keyword :
multichip module , area array I/O , superscalar processor , process design kit
