چكيده فارسي :
Abstract- Shape memory alloys (SMAs), recently are used extensively to enhance mechanical properties of composite
materials. In the present paper incremental micromechanics model based on Eshelbyʹs equivalent inclusion and
Halpin-Tsai model is developed for prediction the elastic properties of randomly oriented SMA/epoxy composites,
considering stress-temperature dependence behavior of SMA. Experimental tensile tests on SMA/epoxy composites
were also performed in order to verify the micro mechanics results. For obtaining the mechanical properties of super
elastic SMA, unidirectional tensile test was performed on wires initially. The micromechanics results showed good
agreement with the experimental data at low weight fractions of SMA wires. However, at higher weight fractions of
SMA wires, the model overestimates the Youngʹs modulus of the composite. This is due to the effect of the interface
between SMA wires and epoxy resin which is assumed to be perfectly bonded in the micromechanics model. The
detailed analysis and results are presented in the full length paper.
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