شماره ركورد كنفرانس :
3536
عنوان مقاله :
Exploring a Low-Cost Inter-layer Communication Scheme for 3D Networks-on-Chip
Author/Authors :
Amir-Mohammad Rahmani Turku Centre for Computer Science (TUCS), Turku, Finland , Pasi Liljeberg Computer Systems Lab. - Department of Information Technology - University of Turku, Finland , Juha Plosila Computer Systems Lab. - Department of Information Technology - University of Turku, Finland , Hannu Tenhunen Turku Centre for Computer Science (TUCS), Turku, Finland
كليدواژه :
Low-Cost Inter-layer , Scheme for 3D Networks , Networks-on-Chip
عنوان كنفرانس :
پانزدهمين همايش بين المللي معماري كامپيوتر و سيستم هاي ديجيتال
چكيده لاتين :
In this paper, a low-cost 3D NoC architecture
based on Bidirectional Bisynchronous Vertical Channels (BBVC)
is proposed as a solution to mitigate high area footprints of
vertical interconnects. Dynamically self-configurable BBVCs,
which can transmit flits in either direction, enable a system to
benefit from a high-speed bidirectional channel instead of a pair
of unidirectional channels for inter-layer communication. In this
architecture, low-latency attribute of the interconnect TSVs
enables the system to support a higher frequency for vertical
channels, better bandwidth utilization, lower area footprint, and
improved routability. In addition, an enhanced BBVC-based
communication scheme, called Direct Vertical Channel Access, is
presented to enable an express inter-layer communication.
Experimental results verify that the proposed architecture can
reduce up to 47% TSV area footprint with a negligible
performance degradation.