• DocumentCode
    1000088
  • Title

    Modeling of Connections Taking Into Account Return Plane: Application to EMI Modeling for Railway

  • Author

    Clavel, Edith ; Roudet, James ; Chevalier, Thierry ; Postariu, Dragos Mihai

  • Author_Institution
    Grenoble Genie Electr. Lab., Grenoble
  • Volume
    56
  • Issue
    3
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    678
  • Lastpage
    684
  • Abstract
    The modeling of electrical characteristics of connections is an important stage of the design phase of a structure. Indeed, they have an impact on the current density distributions inside conductors as well as on the current distributions when several components are connected in parallel. In the case of a return plane in the studied structure as for power electronics converters or railway applications, the model of connections has to be improved in order to represent the physics better. For the first application field, the cooling system itself can be a ground plane, and for the second one, the earth has to be modeled. This paper presents different ways to take into account a return plane while modeling the electrical equivalent circuit of connections above it. It starts with the simplest one, the image method, and continues with the use of a complex skin depth result of solving the Carson integral.
  • Keywords
    electromagnetic interference; equivalent circuits; railway electrification; Carson integral; EMI modeling; conductors; connection modeling; cooling system; current density distributions; electrical characteristics; electrical equivalent circuit; ground plane; image method; power electronic converters; railway; railway applications; return plane; skin depth result; structure design phase; Electromagnetic interference (EMI) modeling; equivalent impedance; finite-element method (FEM); partial-element equivalent circuit (PEEC) method; railway system; transmission line modeling;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2008.2008344
  • Filename
    4682707