DocumentCode
1000224
Title
Hot carrier-induced degradation in bulk FinFETs
Author
Kim, Sang-Yun ; Lee, Jong Ho
Author_Institution
Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., Daegu, South Korea
Volume
26
Issue
8
fYear
2005
Firstpage
566
Lastpage
568
Abstract
Hot-carrier effects in n-channel bulk FinFETs were investigated for the first time. For VDS larger than about 1.4 V, stress bias condition of VGS=VDS showed shorter lifetime than that of VGS=VDS/2 stress condition. The hot-carrier-induced degradation was checked by changing the fin body width, and increased with decreasing the width. Bulk FinFETs with (100) side surface orientation showed less gmmax degradation than that of the device with [110] side surface. The supply voltage which meets 10 years lifetime at the stress bias condition of VGS=VDS was 1.2 V.
Keywords
field effect transistors; hot carriers; semiconductor device reliability; 1.2 V; hot carrier effects; hot-carrier-induced degradation; n-channel bulk FinFET; stress bias condition; CMOS technology; Degradation; FinFETs; Hot carrier effects; Hot carriers; Scalability; Silicon compounds; Silicon on insulator technology; Stress; Transconductance; Bulk FinFET; degradation; hot-carrier effects;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2005.852534
Filename
1468224
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