Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate

Author

Desmulliez, M.P.Y. ; Pang, A.J. ; Leonard, M. ; Dhariwal, R.S. ; Yu, W. ; Abraham, E. ; Bognar, Gy ; Poppe, A. ; Horvath, Gy ; Kohari, Zs ; Rencz, M. ; Emerson, D.R. ; Barber, R.W. ; Slattery, O. ; Waldron, F. ; Cordero, N.

Author_Institution

Microsyst. Eng. Center (MISEC), Heriot-Watt Univ., Edinburgh

Volume

32

Issue

1

fYear

2009

fDate

3/1/2009 12:00:00 AM

Firstpage

20

Lastpage

29

Abstract

The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-mu m width and 70-mu m height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/m² K have been measured for a nitrogen flow rate of 120 l/h.

Keywords

LIGA; forced convection; integrated circuit packaging; microchannel flow; microfabrication; nickel; thermal management (packaging); thermal resistance; UV-LIGA technology; forced convection; heat transfer coefficient; microelectronic packaging; nickel-based plate; partial thermal resistance measurement; size 100 mum; size 70 mum; thermal behavior; two-layer electroforming process; wafer-scale radial microchannel cooling plate; Cooling devices; UV-LIGA; microchannel; modeling and simulation; thermal management;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2008.2002434

Filename

4682735