DocumentCode :
1000695
Title :
Formation of interface traps in MOSFETs during annealing following low temperature irradiation
Author :
Saks, N.S. ; Klein, R.B. ; Griscom, D.L.
Author_Institution :
US Naval Res. Lab., Washington, DC, USA
Volume :
35
Issue :
6
fYear :
1988
fDate :
12/1/1988 12:00:00 AM
Firstpage :
1234
Lastpage :
1240
Abstract :
The formation of interface traps, Nit, was studied in MOSFETs during isochronal annealing up to 350 K, following exposure to ionizing radiation at 78 K. Two distinct Nit formation processes are observed. A small (1-10% of total) process occurs at 100-150 K, which is caused by neutral atomic hydrogen, and a second, higher-temperature (200-300 K) process that accounts for most ( >90%) of the Nit formation also occurs. The characteristics of the high-temperature process support the proton (H+) model of N it formation and are not in agreement with several other common models. Charge pumping and inversion layer mobility techniques for determining Nit are compared. It is found that the mobility cannot be used to determine Nit at 78 K (in contrast to its successful use at 295 K), probably because of lateral uniformities in the large radiation-induced fixed oxide charge
Keywords :
annealing; gamma-ray effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; 350 K; 78 K; MOSFETs; charge pumping; gamma irradiation; interface traps; inversion layer mobility; ionizing radiation; isochronal annealing; lateral uniformities; low temperature irradiation; proton model; radiation-induced fixed oxide charge; Annealing; Atomic measurements; Bonding; Charge measurement; Charge pumps; Current measurement; Hydrogen; Ionizing radiation; MOSFETs; Temperature;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.25445
Filename :
25445
Link To Document :
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