DocumentCode :
1000852
Title :
Photoresist coating methods for the integration of novel 3-D RF microstructures
Author :
Pham, Nga Phuong ; Boellaard, E. ; Burghartz, Joachim N. ; Sarro, Pasqualina M.
Author_Institution :
Lab. of Electron. Components, Delft Univ. of Technol., Netherlands
Volume :
13
Issue :
3
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
491
Lastpage :
499
Abstract :
This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition (ED) are introduced and investigated for the fabrication of 3-D microstructures and RF-MEMS devices. Characteristics of each method as well as its advantage and disadvantages are outlined. A comparison is made to point out the most suitable coating method in terms of complexity, performance and type of application. The potential of these coating methods is demonstrated through several applications such as fabrication of multilevel micromachined structures and RF MEMS devices.
Keywords :
electrodeposition; micromechanical devices; photoresists; spray coating techniques; surface topography; 3D RF microstructures; RF-MEMS devices; electrodeposition; lithography; multilevel micromachined structures; photoresist coating methods; spray coating; topography surfaces; Coatings; Etching; Fabrication; Micromechanical devices; Microstructure; Radio frequency; Radiofrequency microelectromechanical systems; Resists; Spraying; Surface topography; -D structures; ED; Electrodeposition; lithography for MEMS; patterning; photoresist coating; spray coating;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2004.828728
Filename :
1303627
Link To Document :
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