DocumentCode :
1000938
Title :
Total-dose hardness assurance issues for SOI MOSFETs
Author :
Fleetwood, D.M. ; Tsao, S.S. ; Winokur, P.S.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
35
Issue :
6
fYear :
1988
fDate :
12/1/1988 12:00:00 AM
Firstpage :
1361
Lastpage :
1367
Abstract :
The top-gate, back-gate, and sidewall responses of SIMOX and ZMR SOI/MOS transistors to 10-keV X-ray and Co-60 irradiation are compared. For top-gate and sidewall insulators, Co-60 and 10-keV X-ray irradiations at matched dose rates lead to nearly identical responses. Back-gate response, on the other hand, depends strongly on radiation energy and buried insulator thickness. Different X-ray to Co-60 correlation factors can be observed for other technologies with different sidewall and buried insulator materials and thicknesses. It is demonstrated that it is not possible to define a generic set of worst-case radiation bias conditions for all SOI technologies, as back-gate radiation response can be a strong function of transistor drain bias during exposure. However, the magnitude of this effect can vary with material and device processing, and the detailed changes in Si island potential and insulator electric fields that cause this behavior are not yet understood. Postirradiation effects are also addressed briefly
Keywords :
field effect integrated circuits; inspection; insulated gate field effect transistors; integrated circuit technology; integrated circuit testing; quality control; radiation hardening (electronics); semiconductor technology; semiconductor-insulator boundaries; 10-keV X-ray irradiations; 60Co radiation; Co-60 irradiation; QA; SIMOX; SOI MOSFETs; SOI technologies; Si island potential; ZMR SOI/MOS transistors; back-gate radiation response; buried insulator materials; buried insulator thickness; device processing; insulator electric fields; postirradiation effects; quality assurance; radiation energy; radiation hardened electronics; sidewall insulators; sidewall responses; total dose hardness assurance issues; transistor drain bias; Annealing; Circuit testing; Dielectrics and electrical insulation; Electric potential; Laboratories; Lead compounds; MOSFETs; Metal-insulator structures; Performance evaluation; Silicon on insulator technology;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.25465
Filename :
25465
Link To Document :
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