Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell

A new technique, the magnetic field assisted bonding is described for proper encapsulation of a thin-film Cu2S-CdS solar cell. This is made possible by using a thin layer of nickel coating on the substrate as the back-electrode. Results on the dependence of the series resistance, short-circuit current, open-circuit voltage, shunt resistance, diode ideality factor and fill factor on the magnetic field, the time and the temperature of application and coating of the grid are presented and discussed.