Title :
Using layout technique and direct-tunneling mechanism to promote DC performance of partially depleted SOI devices
Author :
Chen, Shiao-Shien ; Huang-Lu, Shiang ; Tang, Tien-Hao
Author_Institution :
Device Eng. Dept., United Microelectron. Corp., Hsinchu, Taiwan
fDate :
5/1/2004 12:00:00 AM
Abstract :
This paper reports the dc performance enhancements of partially depleted (PD) silicon-on-insulator (SOI) devices with lower subthreshold swing and higher driving capability, kink-onset voltage, and transconductance simultaneously. Based on the measured results, by using layout technique, for floating-body PD SOI pMOSFETs with ultrathin gate-oxide thickness, H-gate configuration with the partial n+ poly-gate shows the best floating-body characteristics as compared to that in T-gate and three-terminal configurations. Owing to the direct-tunneling mechanism in the partial n+ poly-gate, the conduction-band electron tunneling current will make the floating-body potential biased in strong inversion region raised. In addition, due to the larger oxide voltage drop across the partial n+ poly-gate in subthreshold region, the valence-band hole substrate current will result in lower floating-body potential. These dc performance enhancements advantage in both digital and analog designs.
Keywords :
CMOS integrated circuits; MOSFET; semiconductor device reliability; silicon-on-insulator; tunnelling; DC performance; H-gate configuration; conduction-band electron tunneling current; direct-tunneling mechanism; floating body; floating-body PD SOI pMOSFET; kink-onset voltage; layout technique; oxide voltage drop; partially depleted SOI devices; silicon-on-insulator; subthreshold swing; transconductance; ultrathin gate-oxide; CMOS technology; Electrons; Immune system; MOSFETs; Silicon on insulator technology; Substrates; Thickness measurement; Threshold voltage; Transconductance; Tunneling; Direct tunneling; SOI; floating body; kink; partially depleted silicon-on-insulator;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2004.825810