Title :
Guest editorial - Special issue on measurement microsystems
fDate :
6/1/2004 12:00:00 AM
Abstract :
Presents the guest editorial for this issue of the publication.
Keywords :
Application specific integrated circuits; Assembly systems; Collaborative work; Digital signal processing; Integrated circuit measurements; Integrated circuit packaging; Microelectromechanical systems; Micromechanical devices; Sensor systems and applications; Time factors;
Journal_Title :
Instrumentation & Measurement Magazine, IEEE
DOI :
10.1109/MIM.2004.1304552
