Development of novel architecture and assembly techniques for a detector unit for a silicon microvertex detector using the flip-chip bonding method

Author

Saitoh, Y. ; Yamanaka, J. ; Suzuki, H. ; Miyahara, S. ; Kamiya, M. ; Kadoi, K. ; Masuda, T. ; Maemura, K. ; Inoue, M. ; Suzuki, A. ; Takeuchi, H. ; Mandai, M. ; Kanazawa, H. ; Higashi, Y. ; Ikeda, H. ; Koike, S. ; Matsuda, T. ; Ozaki, H. ; Tanaka, M. ; Ts

Author_Institution

SEIKO Instruments Inc., Chiba, Japan

Volume

40

Issue

4

fYear

1993

fDate

8/1/1993 12:00:00 AM

Firstpage

552

Lastpage

556

Abstract

Full-size models of a detector unit for a silicon microvertex-detector for the KEK B factory are built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end boards with dummy readouts VLSIs mounted on both sides. In this trial the flip-chip bonding (FCB) method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 μm. The structure using the FCB method successfully provides a new architecture for the detector unit of a vertex detector

Keywords

position sensitive particle detectors; semiconductor counters; semiconductor technology; 50 micron; KEK B factory; Si microstrip detector; Si microvertex detector; VLSIs; assembly techniques; flip-chip bonding method; strip pitch; Anisotropic conductive films; Assembly; Bonding; Bridges; Decision support systems; Detectors; Silicon; Strips; Very large scale integration; Wire;

fLanguage

English

Journal_Title

Nuclear Science, IEEE Transactions on

Publisher

ieee

ISSN

0018-9499

Type

jour

DOI

10.1109/23.256614

Filename

256614