Title :
44th Electronic Components and Technology Conference
fDate :
8/1/1995 12:00:00 AM
Abstract :
The following topics were dealt with: flip-chip/BGA packaging; enhanced packaging; modelling and simulation; encapsulants and moulding compounds; reliability of plastic packages; devices, technologies and applications; process advances; systems and modules; optoelectronic devices; metallisation and PCB processes; thermal simulation and electronic package characterisation; interconnection reliability assessment; leadframe packaging advances; PCBs for HF applications; die attach, adhesive and solder materials; ceramics and thick films; optoelectronic materials; multichip modules; electronic connector technology; gold-based interconnection systems; optical fibres and connectors; reliability test methods; hand soldering
Keywords :
adhesion; ceramics; electric connectors; encapsulation; metallisation; modules; multichip modules; optical fibres; optoelectronic devices; packaging; printed circuits; reliability; soldering; thermal analysis; thick films; BGA packaging; HF applications; PCB processes; adhesive materials; ceramics; die attach; electronic connector technology; electronic package characterisation; encapsulants; flip chip packaging; gold-based interconnection systems; hand soldering; interconnection reliability assessment; leadframe packaging; metallisation; modelling; modules; moulding compounds; multichip modules; optical connectors; optical fibres; optoelectronic devices; optoelectronic materials; plastic package reliability; reliability test methods; simulation; solder materials; thermal simulation; thick films; Connectors; Electronic components; Electronic packaging thermal management; Inorganic materials; Lead; Materials reliability; Metallization; Optical materials; Optoelectronic devices; Plastic packaging;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
