DocumentCode :
1010213
Title :
Digital Circuit Design Challenges and Opportunities in the Era of Nanoscale CMOS
Author :
Calhoun, By Benton H ; Cao, Yu ; Li, Xin ; Mai, Ken ; Pileggi, Lawrence T. ; Rutenbar, Rob A. ; Shepard, Kenneth L.
Author_Institution :
Virginia Univ., Charlottesville
Volume :
96
Issue :
2
fYear :
2008
Firstpage :
343
Lastpage :
365
Abstract :
Well-designed circuits are one key ldquoinsulatingrdquo layer between the increasingly unruly behavior of scaled complementary metal-oxide-semiconductor devices and the systems we seek to construct from them. As we move forward into the nanoscale regime, circuit design is burdened to ldquohiderdquo more of the problems intrinsic to deeply scaled devices. How this is being accomplished is the subject of this paper. We discuss new techniques for logic circuits and interconnect, for memory, and for clock and power distribution. We survey work to build accurate simulation models for nanoscale devices. We discuss the unique problems posed by nanoscale lithography and the role of geometrically regular circuits as one promising solution. Finally, we look at recent computer-aided design efforts in modeling, analysis, and optimization for nanoscale designs with ever increasing amounts of statistical variation.
Keywords :
CMOS logic circuits; circuit CAD; integrated circuit interconnections; nanoelectronics; nanolithography; clock distribution; computer-aided design; digital circuit design; geometrically regular circuits; logic circuit interconnects; memories; nanoscale CMOS; nanoscale lithography; power distribution; scaled complementary metal-oxide-semiconductor devices; simulation models; CMOS digital integrated circuits; Circuit synthesis; Clocks; Digital circuits; Integrated circuit interconnections; Logic circuits; MOS devices; Nanoscale devices; Power distribution; Power system interconnection; Clock distribution; complementary metal–oxide–semiconductor (CMOS); complementary metal–oxide–semiconductor (CMOS); device scaling; digital circuits; lithography; logic; manufacturability; memory; optimization; power distribution; regular circuit fabrics; statistical variability; yield;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2007.911072
Filename :
4403891
Link To Document :
بازگشت