DocumentCode
1010249
Title
Thermal donor and new donor generation in SOI material formed by oxygen implantation
Author
Cristoloveanu, S. ; Pumfrey, J. ; Scheid, E. ; Hemment, P.L.F. ; Arrowsmith, R.P.
Author_Institution
ENSERG, LPCS, UA-CNRS, Grenoble, France
Volume
21
Issue
18
fYear
1985
Firstpage
802
Lastpage
804
Abstract
The oxygen content of silicon-on-insulator films, formed by oxygen implantation, is shown to be responsible for the generation of high-density free carriers: thermal donors at 450°C and new donors at 750°C. The variation of sheet resistance and spreading resistance profiles is measured after successive isochronal and isothermal anneals. The initial generation rate of new donors greatly exceeds that of thermal donors, suggesting a surface-states-related mechanism.
Keywords
carrier mobility; electrical conductivity measurement; ion implantation; semiconductor-insulator boundaries; O implantation; SOI material; Si-on-insulator; donor generation; high-density free carriers; isochronal anneals; isothermal anneals; sheet resistance; spreading resistance; surface-states-related mechanism; thermal donors;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19850566
Filename
4251365
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