DocumentCode :
10105
Title :
PowerField: A Probabilistic Approach for Temperature-to-Power Conversion Based on Markov Random Field Theory
Author :
Seungwook Paek ; Wongyu Shin ; Jaehyeong Sim ; Lee-Sup Kim
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Volume :
32
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
1509
Lastpage :
1519
Abstract :
Temperature-to-power technique is useful for post-silicon power model validation. However, the previous works were applicable only to the steady-state analysis. In this paper, we propose a new temperature-to-power technique, named PowerField, supporting both transient and steady-state analysis based on a probabilistic approach. Unlike the previous works, PowerField uses two consecutive thermal images to find the most feasible power distribution that causes the change between the two input images. To obtain the power map with the highest probability, we adopted maximum a posteriori Markov random field (MAP-MRF). For MAP-MRF framework, we modeled the spatial thermal system as a set of thermal nodes and derived an approximated transient heat transfer equation that requires only the local information of each thermal node. Experimental results with a thermal simulator show that PowerField outperforms the previous method in transient analysis reducing the error by half on average. We also show that our framework works well for steady-state analysis by using two identical steady-state thermal maps as inputs. Lastly, an application to determining the binary power patterns of an FPGA device is presented achieving 90.7% average accuracy.
Keywords :
Markov processes; heat transfer; infrared imaging; maximum likelihood estimation; power conversion; power measurement; transient analysis; FPGA device; MAP-MRF; PowerField; approximated transient heat transfer equation; binary power patterns; maximum a posteriori Markov random field; post-silicon power model validation; power distribution; power map; spatial thermal system; steady-state analysis; temperature-to-power conversion; thermal images; thermal node; transient analysis; Equations; Heating; Mathematical model; Steady-state; Temperature measurement; Thermal resistance; Transient analysis; Graph cuts; Markov random field; post-silicon power validation; temperature-to-power;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2013.2272542
Filename :
6600867
Link To Document :
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