Title :
Sealing metal and ceramic parts by forming reactive alloys
Author_Institution :
General Electric Research Lab., Schenectady, N. Y.
fDate :
4/1/1957 12:00:00 AM
Keywords :
Application software; Assembly; Ceramics; Circuits; Diodes; Electron devices; Electron emission; Fabrication; Inorganic materials; Radiofrequency amplifiers; Sealing materials; Seals; Temperature; Temperature dependence; Thyratrons; Titanium;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1957.14265
