DocumentCode
1011523
Title
Sealing metal and ceramic parts by forming reactive alloys
Author
Beggs, J.E.
Author_Institution
General Electric Research Lab., Schenectady, N. Y.
Volume
4
Issue
2
fYear
1957
fDate
4/1/1957 12:00:00 AM
Firstpage
193
Lastpage
193
Keywords
Application software; Assembly; Ceramics; Circuits; Diodes; Electron devices; Electron emission; Fabrication; Inorganic materials; Radiofrequency amplifiers; Sealing materials; Seals; Temperature; Temperature dependence; Thyratrons; Titanium;
fLanguage
English
Journal_Title
Electron Devices, IRE Transactions on
Publisher
ieee
ISSN
0096-2430
Type
jour
DOI
10.1109/T-ED.1957.14265
Filename
1472244
Link To Document