DocumentCode :
1011544
Title :
Improved hot-carrier resistance with fluorinated gate oxides
Author :
MacWilliam, Kenneth ; Halle, L.F. ; Zietlow, T.C.
Author_Institution :
Aerosp. Corp., Los Angeles, CA, USA
Volume :
11
Issue :
1
fYear :
1990
Firstpage :
3
Lastpage :
5
Abstract :
Improved OFF-state hot-carrier resistance in n-channel MOSFETs observed for fluorinated gate oxides is discussed. One-micrometer fluorinated devices consistently showed approximately three times smaller transconductance reduction and threshold-voltage shift relative to the control (nonfluorinated) MOSFETs. The fluorine was incorporated into the gate oxide by low-energy ion implantation followed by a 920 degrees C diffusion. Subthreshold measurements taken before and after hot-electron stress explicitly show the reduction in interface state generation with fluorine incorporation.<>
Keywords :
hot carriers; insulated gate field effect transistors; interface electron states; ion implantation; 1 micron; 920 degC; OFF-state hot-carrier resistance; Si-SiO/sub 2/; SiO/sub 2/:F; control MOSFET; fluorinated gate oxides; fluorine diffusion; fluorine incorporation; hot-electron stress; interface state generation; low-energy ion implantation; n-channel MOSFETs; subthreshold measurements; threshold-voltage shift; transconductance reduction; Annealing; Electrons; Hot carrier effects; Hot carriers; Hydrogen; Implants; Interface states; MOSFET circuits; Stress; Testing;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.46912
Filename :
46912
Link To Document :
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