Digital IC device testing by transient signal analysis (TSA)

The Letter presents a new approach to testing digital circuits that uses the variations in the transient signals generated within digital circuits as a defect detection method. The I_DD transients on the supply rails and voltage transients at selected test points are sampled over a test interval. Simulation experiments show that variations in the transient waveforms between defective and nondefective circuits exist and that these variations are sensitive to many types of defects even when they appear on off-sensitised paths. These variations can be analysed using pattern recognition techniques, and neural processing is proposed as the means of identifying the transient waveforms of defective devices