DocumentCode :
1013030
Title :
Recent developments in compound semiconductor microwave power transistor technology
Author :
Snowden, C.M.
Author_Institution :
Sch. of Electron. & Electr. Eng., Univ. of Leeds, Shipley, UK
Volume :
151
Issue :
3
fYear :
2004
fDate :
6/17/2004 12:00:00 AM
Firstpage :
259
Lastpage :
264
Abstract :
This paper addresses the state of the art in microwave and millimetre-wave power transistor technology. The relative performance of microwave power transistor technology from 1 GHz to 60 GHz is reviewed. The fundamental technological drivers in the design of microwave compound semiconductor power transistors are discussed as the basis for developing optimum designs. A new high yield power GaAs pHEMT process is described and the application of this technology to multicarrier microwave power amplifiers is discussed, achieving state of the art performance, with output powers of up to 120 W with 70% efficiency at 2.1 GHz.
Keywords :
MOSFET; chemical vapour deposition; electric resistance; power semiconductor devices; semiconductor device manufacture; 10 V; 15 V; 35 V; LOCOS; N-channel device; P-body/N-epi junction; Qgd reduction; W-gated trench power MOSFET; WFET; gate-drain charge; junction self-alignment; on-resistance reduction; oxide layer; production process margin; subatmospheric CVD process; trench bottom;
fLanguage :
English
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
Publisher :
iet
ISSN :
1350-2409
Type :
jour
DOI :
10.1049/ip-cds:20040453
Filename :
1306931
Link To Document :
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