DocumentCode :
1014139
Title :
Failure-mechanism models for creep and creep rupture
Author :
Li, Junhui ; Dasgupta, Abhijit
Author_Institution :
CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
Volume :
42
Issue :
3
fYear :
1993
fDate :
9/1/1993 12:00:00 AM
Firstpage :
339
Lastpage :
353
Abstract :
This tutorial illustrates design situations where creep and creep rupture of components can compromise system performance over time, thereby acting as a wearout failure mechanism. Polycrystalline materials, such as metals and ceramics, and polymers are treated. Analytic microstructural creep mechanisms leading to failure of these materials are presented. Continuum microscale models for predicting long-term creep are explained for practical design purposes. Two examples illustrate these models for mechanical engineering and electronic packaging situations
Keywords :
ceramics; creep; creep fracture; failure analysis; mechanical engineering; metals; packaging; polymers; reliability theory; analytical models; ceramics; continuum microscale models; creep rupture; electronic packaging; long-term creep; mechanical engineering; metals; microstructural creep mechanisms; polycrystalline materials; polymers; tutorial; wearout failure mechanism; Ceramics; Creep; Deformable models; Electronics packaging; Failure analysis; Plastics; Polymers; Reliability engineering; Stress; Temperature;
fLanguage :
English
Journal_Title :
Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9529
Type :
jour
DOI :
10.1109/24.257816
Filename :
257816
Link To Document :
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