Title :
Thermal-compression bonded contacts in large area silicon diodes
Author_Institution :
Bell Telephone Laboratories, Inc., Allentown, Pa.
fDate :
4/1/1959 12:00:00 AM
Keywords :
Alloying; Bonding; Cathodes; Detectors; Diodes; Electrodes; Germanium; Gold; Indium; Nitrogen; Silicon; Soldering; Temperature;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1959.14535
