• DocumentCode
    1014336
  • Title

    Three-Dimensional RF MEMS Switch for Power Applications

  • Author

    Choi, Joo-Young ; Ruan, Jinyu ; Coccetti, Fabio ; Lucyszyn, Stepan

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Imperial Coll. London, London
  • Volume
    56
  • Issue
    4
  • fYear
    2009
  • fDate
    4/1/2009 12:00:00 AM
  • Firstpage
    1031
  • Lastpage
    1039
  • Abstract
    This paper introduces a new concept in 3-D RF microelectromechanical systems switches intended for power applications. The novel switch architecture employs electrothermal hydraulic microactuators to provide mechanical actuation and 3-D out-of-plane silicon cantilevers that have both spring action and latching mechanisms. This facilitates an off-state gap separation distance of 200 mum between ohmic contacts, without the need for any hold power. Having a simple assembly, many of the inherent problems associated with the more traditional suspension-bridge and cantilever-type-beam architectures can be overcome. A single-pole single-throw switch has been investigated, and its measured on-state insertion and return losses are less than 0.3 dB up to 10 GHz and greater than 15 dB up to 12 GHz, respectively, while the off-state isolation is better than 30 dB up to 12 GHz. The switch works well in both hot- and cold-switching modes, with 4.6 W of RF power at 10 GHz and without any signs of degradation to the ohmic contacts.
  • Keywords
    cantilevers; hydraulic actuators; microactuators; microswitches; microwave switches; ohmic contacts; 3D RF MEMS switch; 3D RF microelectromechanical systems switch; 3D out-of-plane silicon cantilevers; cantilever-type-beam architecture; electrothermal hydraulic microactuators; insertion loss; mechanical actuation; ohmic contacts; return loss; single-pole single-throw switch; suspension bridge; Electrothermal hydraulic microactuator; RF microelectromechanical systems (MEMS); high power; paraffin wax; silicon cantilever; switch;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2008.2010087
  • Filename
    4694014