Processing and performance of gold MCMs

Author

Cloud, Todd A. ; Houston, Michael R. ; Kohl, Paul A. ; Bidstrup, Sue Ann

Author_Institution

Dept. of Chem. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

16

Issue

7

fYear

1993

fDate

11/1/1993 12:00:00 AM

Firstpage

724

Lastpage

730

Abstract

The use of gold metallization in multichip modules (MCMs) has been investigated for the purpose of achieving simplified processing and high reliability. A process has been developed for producing multilayered, gold metallization thin film MCM (MCM-D) structures which reduces the number of processing steps compared to copper metallization. Multilayered gold-polymer and gold-SiO₂ test devices have been fabricated to evaluate the electrical and mechanical properties of the structures. The adhesion of a variety of dielectrics has been achieved by blanket coverage of the noble metal with a single step adhesion layer. The processing, performance, adhesion layer, and cost of gold MCM-D structures on silicon substrates have been analyzed

Keywords

adhesion; circuit reliability; elemental semiconductors; gold; metallisation; multichip modules; silicon; silicon compounds; Au-SiO₂-Si; Au-SiO₂-Si structures; MCM-D structures; cost; electrical properties; mechanical properties; metallization; multichip modules; processing steps; reliability; single step adhesion layer; Adhesives; Copper; Costs; Dielectric substrates; Dielectric thin films; Gold; Mechanical factors; Metallization; Multichip modules; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.257860

Filename

257860