Modeling and simulation of coupled transmission line interconnects over a noisy reference plane

Author

Senthinathan, Ramesh ; Nimmagadda, Srinivas ; Prince, John L. ; Cangellaris, Andreas C.

Author_Institution

Adv. Packaging Dev. Center, Motorola Inc., Phoenix, AZ, USA

Volume

16

Issue

7

fYear

1993

fDate

11/1/1993 12:00:00 AM

Firstpage

705

Lastpage

713

Abstract

Limitations in using conventional coupled transmission line simulators to model signal propagation over a noisy reference plane are explained. A distributed lumped element circuit model including reference plane parasitics and associated coupling (to signal conductors) parasitics is developed, and verified using SPICE simulations. Inductance and capacitance per-unit-length [pul] matrix elements are calculated using detailed two-dimensional parasitic extractors, and the partial inductance concept. Results using this model were compared with conventional “isolated” (switching noise isolated) coupled transmission line simulations. Significant differences were found. Package pin placement on the reference plane, and its impact on overall noise characteristics are analyzed

Keywords

SPICE; electronic engineering computing; packaging; transmission line theory; SPICE simulations; capacitance per-unit-length; coupled transmission line interconnect; distributed lumped element circuit model; inductance per-unit-length; noisy reference plane; package pin placement; partial inductance concept; reference plane parasitics; signal propagation; switching noise isolated; two-dimensional parasitic extractors; Circuit noise; Circuit simulation; Conductors; Coupling circuits; Distributed parameter circuits; Inductance; Integrated circuit interconnections; SPICE; Transmission line matrix methods; Transmission lines;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.257863

Filename

257863