DocumentCode
1014522
Title
A wafer scale visual-to-thermal converter
Author
Syrzycki, Marek J. ; Carr, Larrie ; Chapman, Glenn H. ; Parameswaran, M.
Author_Institution
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
Volume
16
Issue
7
fYear
1993
fDate
11/1/1993 12:00:00 AM
Firstpage
665
Lastpage
673
Abstract
Wafer scale transducer arrays (WSTA´s) containing multitransducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining, and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers together with signal conditioning and control circuitry, enabling 75%-50% local redundancy of system components. Unlike digital WSI designs, the WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing even when considering cluster defects. For WSTA, testing of functioning cells for WSI must be supplemented by compensating the transducer nonuniformities across the array
Keywords
CMOS integrated circuits; VLSI; image convertors; image sensors; infrared imaging; packaging; photodetectors; redundancy; silicon; transducers; CMOS technology; Si; WSI; control circuitry; laser interconnection; local redundancy; micromachining; multitransducer arrays; photodetectors; processing circuits; signal conditioning; thermal emitters; thermal scene; transducer arrays; visual scene; visual-to-thermal converter; wafer scale integration; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.257868
Filename
257868
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