• DocumentCode
    1014522
  • Title

    A wafer scale visual-to-thermal converter

  • Author

    Syrzycki, Marek J. ; Carr, Larrie ; Chapman, Glenn H. ; Parameswaran, M.

  • Author_Institution
    Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
  • Volume
    16
  • Issue
    7
  • fYear
    1993
  • fDate
    11/1/1993 12:00:00 AM
  • Firstpage
    665
  • Lastpage
    673
  • Abstract
    Wafer scale transducer arrays (WSTA´s) containing multitransducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining, and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers together with signal conditioning and control circuitry, enabling 75%-50% local redundancy of system components. Unlike digital WSI designs, the WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing even when considering cluster defects. For WSTA, testing of functioning cells for WSI must be supplemented by compensating the transducer nonuniformities across the array
  • Keywords
    CMOS integrated circuits; VLSI; image convertors; image sensors; infrared imaging; packaging; photodetectors; redundancy; silicon; transducers; CMOS technology; Si; WSI; control circuitry; laser interconnection; local redundancy; micromachining; multitransducer arrays; photodetectors; processing circuits; signal conditioning; thermal emitters; thermal scene; transducer arrays; visual scene; visual-to-thermal converter; wafer scale integration; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.257868
  • Filename
    257868