Title :
A wafer scale visual-to-thermal converter
Author :
Syrzycki, Marek J. ; Carr, Larrie ; Chapman, Glenn H. ; Parameswaran, M.
Author_Institution :
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
fDate :
11/1/1993 12:00:00 AM
Abstract :
Wafer scale transducer arrays (WSTA´s) containing multitransducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining, and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers together with signal conditioning and control circuitry, enabling 75%-50% local redundancy of system components. Unlike digital WSI designs, the WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing even when considering cluster defects. For WSTA, testing of functioning cells for WSI must be supplemented by compensating the transducer nonuniformities across the array
Keywords :
CMOS integrated circuits; VLSI; image convertors; image sensors; infrared imaging; packaging; photodetectors; redundancy; silicon; transducers; CMOS technology; Si; WSI; control circuitry; laser interconnection; local redundancy; micromachining; multitransducer arrays; photodetectors; processing circuits; signal conditioning; thermal emitters; thermal scene; transducer arrays; visual scene; visual-to-thermal converter; wafer scale integration; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on