A forecast on the future of hybrid wafer scale integration technology

Author

Fillion, Raymond A.

Author_Institution

Corp. Res. & Dev. Center, Gen. Electr. Co., Schenectady, NY, USA

Volume

16

Issue

7

fYear

1993

fDate

11/1/1993 12:00:00 AM

Firstpage

615

Lastpage

625

Abstract

Any detailed discussion of high performance packaging for the next generation electronics systems must include both hybrid wafer scale integration (H-WSI) and monolithic wafer scale integration (M-WSI). A H-WSI circuit is a multichip module (MCM) that contains 20-50 chips with at least ten times the maximum functionality that can be readily achieved in one complex chip. A M-WSI circuit is a monolithic semiconductor (silicon generally) chip that contains a large number of cells that in total contain at least ten times the functionality that can be readily achieved in one complex chip. These devices could be called a system on a chip. This paper describes the driving forces behind WSI technologies, defines where the H-WSI technologies are today and forecasts where these are likely to evolve to in the future

Keywords

VLSI; hybrid integrated circuits; integrated circuit technology; multichip modules; technological forecasting; H-WSI circuit; functionality; high performance packaging; hybrid IC technology; hybrid wafer scale integration technology; multichip module; CMOS technology; Integrated circuit interconnections; Integrated circuit technology; Lead compounds; Multichip modules; Silicon; Space technology; Technology forecasting; Very large scale integration; Wafer scale integration;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.257873

Filename

257873