Title :
AlGaN/GaN HEMTs With Thin InGaN Cap Layer for Normally Off Operation
Author :
Mizutani, T. ; Ito, M. ; Kishimoto, S. ; Nakamura, F.
Author_Institution :
Nagoya Univ., Nagoya
fDate :
7/1/2007 12:00:00 AM
Abstract :
AlGaN/GaN HEMTs with a thin InGaN cap layer have been proposed to implement the normally off HEMTs. The key idea is to employ the polarization-induced field in the InGaN cap layer, by which the conduction band is raised, which leads to the normally off operation. The fabricated HEMT with an In0.2Ga0.8N cap layer with a thickness of 5 nm showed normally off operation with a threshold voltage of 0.4 V and a maximum transconductance of 85 mS/mm for the device with a 1.9-mum-long gate. By etching off the In0.2Ga0.8N cap layer at the access region using gate electrode as an etching mask, the maximum transconductance has increased from 85 to 130 mS/mm due to a reduction of the parasitic source resistance.
Keywords :
III-V semiconductors; aluminium compounds; etching; gallium compounds; high electron mobility transistors; wide band gap semiconductors; AlGaN-GaN - Interface; HEMT; InGaN - Interface; etching mask; gate electrode; maximum transconductance; normally off operation; parasitic source resistance; polarization induced field; size 5 nm; thin cap layer; voltage 0.4 V; Aluminum gallium nitride; Electrons; Etching; Gallium nitride; HEMTs; Indium tin oxide; MODFETs; Optical polarization; Threshold voltage; Transconductance; AlGaN/GaN; HEMT; InGaN cap; normally off; polarization-induced field;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2007.900202