• DocumentCode
    1014736
  • Title

    Observation of Metal-Layer Stress on Si Nanowires in Gate-All-Around High- κ/Metal-Gate Device Structures

  • Author

    Singh, N. ; Fang, W.W. ; Rustagi, S.C. ; Budharaju, K.D. ; Teo, Selin H G ; Mohanraj, S. ; Lo, G.Q. ; Balasubramanian, N. ; Kwong, D.L.

  • Author_Institution
    Inst. of Microelectron., Singapore
  • Volume
    28
  • Issue
    7
  • fYear
    2007
  • fDate
    7/1/2007 12:00:00 AM
  • Firstpage
    558
  • Lastpage
    561
  • Abstract
    This letter reports, for the first time, the observation of mechanical stress from metal-gate layer on the Si nanowires formed by the top-down scheme. High-kappa (HfO2 ~ 5 nm) and metal-gate (TaN ~ 100 nm) are evaluated on Si nanowires having ~5-7 nm diameter. While no significant mechanical effect is observed after high-kappa deposition, the TaN metal layer is found to viciously stretch and twist the straight wires. The wire lengths increase significantly (~3%), which suggests that the Si nanowires are subjected to large tensile strain ( > 4 GPa), assuming that the wires obey Hooke´s law with Young´s modulus ~150 GPa for bulk Si. Interestingly, the twisted nanowires maintained their physical continuity, as demonstrated by the excellent performance of the fully functional gate-all-around MOSFETs fabricated with the wires as channels.
  • Keywords
    MOSFET; dielectric materials; elemental semiconductors; hafnium compounds; nanowires; silicon; tantalum compounds; HfO2 - Binary; Hooke law; Si - Element; Si nanowires; TaN - Binary; Young modulus; fully functional gate-all-around MOSFET; gate-all-around high-kappa/metal-gate device structures; high-kappa deposition; mechanical stress; metal-gate layer; metal-layer stress; tensile strain; twisted nanowires; Dielectrics; Electrodes; Gate leakage; Hafnium oxide; MOSFETs; Microelectronics; Nanowires; Stress; Transistors; Wires; Gate-all-around (GAA); MOSFETs; Si nanowire; metal gate; stretched; twisted;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2007.899330
  • Filename
    4252220