• DocumentCode
    1014766
  • Title

    Dynamic SPICE-simulation of the electrothermal behavior of SOI MOSFET´s

  • Author

    Bielefeld, Juergen ; Pelz, Georg ; Abel, Hans Bernd ; Zimmer, Günter

  • Author_Institution
    Dept. of Electron. Devices & Circuits, Univ. Gesamthochschule Duisburg, Germany
  • Volume
    42
  • Issue
    11
  • fYear
    1995
  • fDate
    11/1/1995 12:00:00 AM
  • Firstpage
    1968
  • Lastpage
    1974
  • Abstract
    A nonlinear dynamic electrothermal model of the SOI MOSFET is implemented and used in SPICE3. This model is formulated as a set of algebraic and (partial) differential equations which is converted into a SPICE3 netlist automatically by a model translator. Neither is the simulator rewritten nor are SPICE device models implemented or changed. In this way, the presented approach supports effective model development. To show the electrothermal interaction, the SOI MOSFET model is applied to several static and dynamic simulations. The SPICE-simulation results of the thermal model are verified with the commercial finite-element simulator ANSYS
  • Keywords
    MOSFET; SPICE; digital simulation; partial differential equations; semiconductor device models; silicon-on-insulator; ANSYS; SOI MOSFET; SPICE3; dynamic SPICE-simulation; finite-element simulator; model translator; nonlinear dynamic electrothermal model; partial differential equations; thermal model; Circuit simulation; Coupling circuits; Differential equations; Electrothermal effects; Electrothermal launching; MOSFET circuits; SPICE; Temperature; Thermal resistance; Vehicle dynamics;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.469405
  • Filename
    469405