Title :
High average power dissipation in helix tubes
Author_Institution :
Stewart Engineering Co., Santa Cruz, Calif.
fDate :
4/1/1960 12:00:00 AM
Abstract :
By precisely shrinking the glass envelope around the helix to a controlled depth, thus providing an exceptionally low thermal impedance to the outside of the envelope, and passing a suitable coolant over the envelope, it has been found that the power dissipation capability of helix circuits can be extended by more than one order of magnitude. A qualitative analysis indicates that the heat transfer characteristics should be as good as the experimental results indicate.
Keywords :
Circuits; Coolants; Cooling; Cutoff frequency; Electron devices; Geometry; Glass; Impedance; Music; Power dissipation; Radio frequency; Telephony; Temperature control; Thermal conductivity;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1960.14596