DocumentCode
1016478
Title
Quasi-SOI MOSFETs—A Promising Bulk Device Candidate for Extremely Scaled Era
Author
Tian, Yu ; Xiao, Han ; Huang, Ru ; Feng, Chuguang ; Chan, Mansun ; Chen, Baoqin ; Wang, Runsheng ; Zhang, Xing ; Wang, Yangyuan
Author_Institution
Peking Univ., Beijing
Volume
54
Issue
7
fYear
2007
fDate
7/1/2007 12:00:00 AM
Firstpage
1784
Lastpage
1788
Abstract
Results from a novel quasi-SOI CMOS architecture fabricated on bulk SI are reported for the first time, demonstrating its viability as an alternative device for the nanometer regime. All of the processing is basically compatible with the conventional CMOS technology. The short-channel effects and the drain-induced barrier-lowering effects can be effectively suppressed by the "L-type" insulator surrounding the source/drain regions. In addition, quasi-SOI MOSFETs can be more tolerant of process- induced variation for the deep nanometer regime. The quasi-SOI MOSFET can be considered as one of the promising candidates for highly scaled devices.
Keywords
CMOS integrated circuits; MOS integrated circuits; elemental semiconductors; nanotechnology; silicon; silicon-on-insulator; L-type insulator; Si-SiO2 - Interface; bulk device structure; conventional CMOS technology; deep nanometer regime; drain-induced barrier-lowering effects; quasiSOI MOSFET; short-channel effects; CMOS process; CMOS technology; Doping; Insulation; Leakage current; MOSFETs; Microelectronics; Nanoscale devices; Semiconductor process modeling; Silicon on insulator technology; CMOS; SOI; drain-induced barrier lowering (DIBL); quasi-SOI; scaling; short-channel effects (SCEs); ultrathin body (UTB);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2007.899401
Filename
4252386
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