DocumentCode
1016497
Title
A hermetically-sealed encapsulation for microwave junction diodes
Author
Boore, E.J. ; Elder, H.E.
Author_Institution
Bell Telephone Labs., Inc., Allentown, Pa.
Volume
8
Issue
2
fYear
1961
fDate
3/1/1961 12:00:00 AM
Firstpage
181
Lastpage
181
Keywords
Alloying; Capacitance; Circuit testing; Circuits; Diodes; Encapsulation; Fabrication; Germanium; Klystrons; Microwave amplifiers; Noise figure; Power generation; Refrigeration; Semiconductor diodes; Temperature; Thermoelectricity; Tunable circuits and devices;
fLanguage
English
Journal_Title
Electron Devices, IRE Transactions on
Publisher
ieee
ISSN
0096-2430
Type
jour
DOI
10.1109/T-ED.1961.14768
Filename
1472931
Link To Document