• DocumentCode
    1016506
  • Title

    Oxide-Trapped Charges Induced by Electrostatic Discharge Impulse Stress

  • Author

    Tseng, Jen-Chou ; Hwu, Jenn-Gwo

  • Author_Institution
    Nat. Taiwan Univ., Taipei
  • Volume
    54
  • Issue
    7
  • fYear
    2007
  • fDate
    7/1/2007 12:00:00 AM
  • Firstpage
    1666
  • Lastpage
    1671
  • Abstract
    The characteristics of oxide-trapped charges Qot induced by electrostatic discharge high-field current impulse stress, i.e., transmission line pulsing (TLP), were studied. It was observed that for a 3.2-nm-thin oxide, the centroid evolution and the critical density of positive oxide-trapped charges Qot + to trigger oxide breakdown are about the same between dc and TLP impulse stresses. These results are consistent with the existing models of stress-induced trapping charges and hole-induced oxide breakdown. However, different behaviors of Qot and centroid were found for 14-nm-thick oxides subjected to different stress tests. TLP impulse stress generates far less amount of negative oxide- trapped charges Qot - than dc stress, and the positive oxide-trapped charges finally dominate over the negative oxide-trapped charges. This impulse stress imposes a high density and transient current on the oxide, which induces traps at the tunneling distance locally. The hotter injected electrons generate more efficient hole trappings to provoke breakdown with lower density of oxide-trapped charges in comparison with dc stress test.
  • Keywords
    MOS capacitors; electrostatic discharge; hot carriers; semiconductor device breakdown; semiconductor device reliability; stress effects; MOS devices; electrostatic discharge impulse stress; hole trappings; hot injected electrons; oxide breakdown; oxide-trapped charges; size 14 nm; size 3.2 nm; stress test; transmission line pulsing; Charge carrier processes; DC generators; Electric breakdown; Electron traps; Electrostatic discharge; Power system transients; Stress; Testing; Transmission lines; Tunneling; Electrostatic discharge (ESD); MOS devices; gate dielectrics; oxide-trapped charges; semiconductor device reliability; transmission line pulsing (TLP);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2007.899429
  • Filename
    4252388